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? 2001-2012 microchip technology inc. ds21378c-page 1 tc1267 features ? glitch free transition between input sources ? automatic input source selection ? external pmos bypass switch control ? built-in 5v detector ? 1% regulated output voltage accuracy ? 400ma load current capability ? kelvin sense input ? low ground current, independent of load applications ? pcmcia ?pci ? network interface cards (nics) ? cardbus tm technology ? desktop computers device selection table pin configuration general description the tc1267 is an application-specific, low dropout regulator (ldo), specifically intended for use in pci peripheral card applications complying with pci power management (pci 2.0). it provides an uninterrupted, 3.3v output voltage when the main (5v) or auxiliary (3.3v) input voltage supplies are present. the tc1267 consists of an ldo, a voltage threshold detector, external switchover logic and gate drive circuitry. it functions as a conventional ldo as long as the voltage on the main supply input (v in ) is above the lower threshold (3.90v typical). should the voltage on v in fall below the lower threshold, the ldo is disabled and an external p-channel mosfet is automatically turned on, connecting the auxiliary supply input to v out, and ensuring an uninterrupted 3.3v output. the main supply is automatically selected, if both the main and auxiliary input supplies are present, and transition from one input supply to the other is ensured glitch- free. high integration, automatic secondary supply swi- tchover, kelvin sensing, and small size make the tc1267 the optimum ldo for pci 2.0 applications. functional block diagram part number package junction temp. range tc1267vet 5-pin ddpak -5c to +95c g nd tab is g n d v au x v in v ou t d r 1 2 3 4 5 t c 12 67 5 -pin ddpa k + ? v in v aux gnd d r v out bandgap reference detect e/a 400ma pci ldo
tc1267 ds21378c-page 2 ? 2001-2012 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings* input supply voltage (v in ).............. -0.5v to +7v (max) auxiliary supply voltage (v aux ) ..... -0.5v to +7v (max) ldo output current (i out )................................400ma thermal impedance, junction-to-ambient ( ? ja ).......... 27c/w for ddpak esd rating .......................................................... 2 kv operating temperature range (t a )........-5c to +70c storage temperature range (t stg ) ...-65c to +150c *stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. tc1267 electrical specifications electrical characteristics: t a = +25c, v in = 5v, v aux = 3.3v, i out = 0.1ma, c out = 4.7 ? f, unless otherwise noted. boldface type specifications apply over full operating range. symbol parameter min typ max units test conditions v in supply voltage 4.4 5.0 5.5 vv aux = 0v i gnd ground current ? ? 230 260 450 500 ? av aux = 0v (note 6) v aux = 3.3v (note 6) i vin reverse leakage from v aux ?-0.1 -1.0 ? av aux = 3.5v, v in = 0v, i out = 0ma v aux supply voltage 3.0 3.3 3.6 v i q(aux) quiescent current ? ? 50 ? 70 100 ? av in = 0v, i out = 0ma ? ? 60 ? 80 120 ? av in = 5v, i out = 0ma i vaux reverse leakage from v in ?-0.1 -1.0 ? av in = 5.5v, v aux = 0v, i out = 0ma v th(lo) 5v detector low threshold voltage ? 3.75 3.90 ? ? 4.05 vv in falling (notes 2, 3) v hyst 5v detector hysteresis voltage ? 200 260 ? ? 300 mv (notes 2, 3) v th(hi) 5v detector high threshold voltage ? 4.0 4.15 ? ? 4.30 vv in rising (notes 2, 3) v out ldo output voltage ? 3.300 ? v i out = 20ma 3.201 ? 3.366 v4.4v ? v in ?? 5.5v, 0ma ?? i out ? 400ma 3.000 ??v0ma ?? i out ??? 400ma (note 4) i out output current 400 ? ? ma reg (line) line regulation ? -0.5 0.05 ? ? +0.5 %v in = 4.3v to 5.5v reg (load) load regulation ? -1.5 -0.1 ? ? +0.5 %i out = 0.1ma to 400ma v dr drive voltage v in - 0.2 v in - 0.3 v in - 0.1 ? ? ? v4.3v ?? v in ? 5.5v, i dr = 200 ? a ? ? 35 ? 150 200 mv v in < v th(lo) , i dr = 200 ? a note 1: ensured by design. 2: see 5v detect thresholds, figure 4-1. 3: recommended source impedance for 5v supply: ?? 0.25 ? . this will ensure that i out x r source < v hyst , thus avoiding d r toggling during 5v detect threshold transitions. 4: in application circuit, figure 3-1. 5: see timing diagram, figure 4-2. 6: ground current is independent of i load .
? 2001-2012 microchip technology inc. ds21378c-page 3 tc1267 tc1267 electrical specifications (continued) electrical characteristics: t a = +25c, v in = 5v, v aux = 3.3v, i out = 0.1ma, c out = 4.7 ? f, unless otherwise noted. boldface type specifications apply over full operating range. symbol parameter min typ max units test conditions i dr(pk) peak drive current 7 6 ? ? ? ? ma sinking: v in = 3.75v, v dr = 1v; sourcing: v in = 4.3v, v in ? v or = 2v t dh drive high delay (notes 1, 5) ? ? 4 ? ? 8 ? sec c dr = 1.2nf, v in ramping up, measured from v in = v th(hi) to v dr = 2v t dl drive low delay (notes 1, 5) ? ? 0.6 ? 1.5 3.0 ? sec c dr = 1.2nf, v in ramping down, measured from v in = v th(lo) to v dr = 2v note 1: ensured by design. 2: see 5v detect thresholds, figure 4-1. 3: recommended source impedance for 5v supply: ?? 0.25 ? . this will ensure that i out x r source < v hyst , thus avoiding d r toggling during 5v detect threshold transitions. 4: in application circuit, figure 3-1. 5: see timing diagram, figure 4-2. 6: ground current is independent of i load .
tc1267 ds21378c-page 4 ? 2001-2012 microchip technology inc. 2.0 pin descriptions the descriptions of the pins are listed in table 2-1. table 2-1: pin function table 3.0 detailed description figure 3-1: application circuit pin no. symbol description 1v aux auxiliary input supply, nominally 3.3v. 2v in main input supply for the tc1267, nominally 5v. 3 gnd logic and power ground. 4v out ldo 3.3v output. 5d r driver output for external p-channel mosfet pass element. 5v 3.3v tab is gnd q1 c3 0.1 f c1 4.7 f c2 0.1 f c4 4.7 f 3.3v tc1267 v in v aux gnd v out d r c5 0.1 f note: external switch (q1): use motorola mgsf1p02elt1 or equivalent (pmos, typical gate threshold voltage = 1v, typical r ds(on) = 0.4 at vgs = 2.5v)
? 2001-2012 microchip technology inc. ds21378c-page 5 tc1267 4.0 thermal considerations 4.1 thermal shutdown integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160c. the regulator remains off until the die temperature drops to approximately 150c. 4.2 power dissipation the amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. the following equation is used to calculate worst case actual power dissipation: equation 4-1: the maximum allowable power dissipation (equation 4-2) is a function of the maximum ambient temperature (t a max ), the maximum allowable die temperature (t j max ) and the thermal resistance from junction-to-air ( ? ja ). equation 4-2: table 4-1 shows various values of ? ja for the tc1267 packages. table 4-1: thermal resistance guidelines for tc1267 in 5-pin ddpak *tab of device attached to topside copper. equation 4-1 can be used in conjunction with equation 4-2 to ensure regulator thermal operation is within limits. for example: given: v in max = 5v 5% v out min = 3.217v i load max = 400ma t j max = 95c t a max = 70c ? ja = 27c/w (ddpak mounted on 1000 sq mm topside copper area) find: 1. actual power dissipation 2. maximum allowable dissipation actual power dissipation: p d ? (v in max ? v out min )i load max = (5.25v - 3.217v) 400ma = 813mw maximum allowable power dissipation: in this example, the tc1267 dissipates a maximum of 813mw; below the allowable limit of 926mw. copper area (topside)* copper area (backside) board area thermal resistance ?? ja ) 2500 sq mm 2500 sq mm 2500 sq mm 25c/w 1000 sq mm 2500 sq mm 2500 sq mm 27c/w 125 sq mm 2500 sq mm 2500 sq mm 35c/w where: p d ? (v in max ? v out min )i load max p d v in max v out min i load max = worst case actual power dissipation = minimum regulator output voltage = maximum output (load) current = maximum voltage on v in p d max = (t j max ? t a max ) ? ja where all terms are previously defined. p d max = (t j max ? t a max ) ? ja = (95 ? 70) 27 = 423mw
tc1267 ds21378c-page 6 ? 2001-2012 microchip technology inc. figure 4-1: 5v detect threshold figure 4-2: timing diagram note: v in rise and fall times (10% to 90%) to be 100 sec. d r v in 3.65v 2.0v 4.4v 2.0v v th(hi) v hyst v th(lo) d r v in 2.0v 4.4v 2.0v note: v in rise and fall times (10% to 90%) to be 0.1 sec. 3.65v t dh t dl
? 2001-2012 microchip technology inc. ds21378c-page 7 tc1267 5.0 typical characteristics note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 i q vs. v in vs. junction temperature 012 34 5 6 v in (v) i q (ma) i o = 0.1ma v aux = 0v +125 c +25 c -5 c 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 i q (aux) vs. v aux vs. junction temperature 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 3.6 v aux (v) i q (aux) (ma) i o = 0ma v aux = 0v +125 c +25 c -5 c 3.34 3.33 3.32 3.31 3.30 3.29 3.28 3.27 3.26 ldo output voltage vs. junction temperature -50 -25 0 25 50 75 100 125 v out (v) i o = 200ma v in = 5v junction temperature c i q vs. v in vs. junction temperature 0 1234 56 v in (v) 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 i q (ma) i o = 0.1ma v aux = 3.3v +125 c +25 c -5 c 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 i q (aux) vs. v aux vs. junction temperature 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 3.6 v aux (v) i q (aux) (ma) i o = 0ma v aux = 5v +125 c +25 c -5 c
tc1267 ds21378c-page 8 ? 2001-2012 microchip technology inc. 5.0 typical characteristics (continued) t r ace 1 : v in stepp i n g f or 0 . 8v to 5v tr ace 2: d r th ( hi ) tdh = < 4 s dr i ve h ig h dela y see application circuit on pa g e 5 i l o a d = 2 00 m a v in ste p s from 0.8v to 5 v trace 1: v in ? 3a charging a 1500 f capacitor trace 2: d r going high at v th(hi) trace 3: v out , offset 3.3v. v out(min) = 3.24v i load = 20ma v o (min) with v in rising notice no voltage spikes during transition from v aux to ldo output v out voltage difference is i out x r ds(on) and variations between v aux supply and ldo output voltage tr ace 1: v in stepp i n g f or 5.5v to 0 v r tdl = < 600n s dr i ve low dela y trace 1: v in ? discharging a 1500 f capacitor trace 2: d r going low at v th(lo) trace 3: v out , offset 3.3v. v out(min) = 3.14v i load = 20ma v o (min) with v in falling v out voltage difference is i out x r ds(on) + voltage difference from ldo to v aux supply
? 2001-2012 microchip technology inc. ds21378c-page 9 tc1267 6.0 packaging information 6.1 package marking information package marking data not available at this time. 6.2 taping form 6.3 package dimensions component taping orientation for 5-pin ddpak devices user direction of feed device marking pin 1 w p standard reel component orientation for tr suffix device (mark right side up) package carrier width (w) pitch (p) part per full reel reel size 5-pin ddpak 24 mm 16 mm 750 13 in carrier tape, number of components per reel and reel size 5-pin ddpak .067 (1.70) typ. .037 (0.94) .026 (0.66) .370 (9.40) .330 (8.38) .067 (1.70) .045 (1.14) .605 (15.37) .549 (13.95) .410 (10.41) .385 (9.78) .183 (4.65) .170 (4.32) .055 (1.40) .045 (1.14) .010 (0.25) .000 (0.00) .110 (2.79) .068 (1.72) .026 (0.66) .014 (0.36) 8 max. 3 - 7 (5x) pin 1 dimensions: inches (mm) note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
tc1267 ds21378c-page 10 ? 2001-2012 microchip technology inc. 7.0 revision history revision c (november 2012) added a note to each package outline drawing.
? 2001-2012 microchip technology inc. ds21378c-page11 tc1267 sales and support data sheets products supported by a preliminary data sheet may have an e rrata sheet describing minor operational differences and recom- mended workarounds. to determine if an erra ta sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
tc1267 ds21378c-page12 ? 2001-2012 microchip technology inc. notes:
? 2001-2012 microchip technology inc. ds21378c-page 13 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2001-2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620767818 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
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